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DATA SHEET
PHOTOCOUPLER
PS2533-1,-2,-4,PS2533L-1,-2,-4
HIGH COLLECTOR TO EMITTER VOLTATGE HIGH ISOLATION VOLTAGE MULTI PHOTOCOUPLER SIRIES
DESCRIPTION
The PS2533-1, -2, -4 and PS2533L-1, -2, -4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington connected phototransistor. The PS2533-1, -2, -4 are in a plastic DIP (Dual In-line Package) and the PS2533L-1, -2, -4 are lead bending type (Gull-wing) for surface mount. -NEPOC
TM
Series-
FEATURES
* High collector to emitter voltage (VCEO = 350 V) * High Isolation voltage BV = 5 000 Vr.m.s.: standard products BV = 3 750 Vr.m.s.: VDE0884 approved products (Option) * High current transfer ratio (CTR = 4 000 % TYP.) * High-speed switching (tr, tf = 100 s TYP.) * Ordering number of taping product: PS2533L-1-E3, E4, F3, F4, PS2533L-2-E3, E4 * UL approved: File No. E72422 (S) * BSI approved: No. 8221/8222 * NEMKO approved: No. 98101708 * SEMKO approved: No. 9824187/01-02 * DEMKO approved: No. 307863 * FIMKO approved: No. F1 11397 * VDE0884 approved (Option)
APPLICATIONS
* Telephone, Exchange equipment * FAX/MODEM
The information in this document is subject to change without notice.
Document No. P11435EJ5V0DS00 (5th edition) Date Published September 1998 NS CP(K) Printed in Japan
The mark * shows major revised points.
(c)
1990
PS2533-1,-2,-4,PS2533L-1,-2,-4
PACKAGE DIMENSIONS (in millimeters) DIP type
PS2533-1
PS2533-2
5.1 MAX. 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2
10.2 MAX. 8 7
TOP VIEW
6 5 1, 3. Anode 2, 4. Cathode 5, 7. Emitter 6, 8. Collector 1 2 3 4
6.5
7.62
2.8 MIN. 4.55 MAX. 2.8 MIN. 4.55 MAX. 3.8 MAX. 3.8 MAX.
6.5
7.62
0.65
0 to 15 0.500.10 0.25 M 2.54
0.65
0 to 15 2.54 0.500.10 0.25 M
1.250.15
1.250.15
PS2533-1 (NEW PACKAGE)
PS2533-4 TOP VIEW
16 15 14 13 12 11 10 9
4.60.35 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector
6.5
20.3 MAX.
1
2
3
4
5
6
7
8
6.5
1
2
1, 3, 5, 7. 2, 4, 6, 8. 9, 11, 13, 15. 10, 12, 14, 16.
Anode Cathode Emitter Collector
7.62
2.8 MIN. 4.55 MAX. 2.8 MIN. 4.55 MAX. 3.8 MAX. 3.8 MAX.
7.62
0.65
0 to 15 0.500.10 0.25 M 2.54
0.65
0 to 15 2.54 0.500.10 0.25 M
1.250.15
1.250.15
2
PS2533-1,-2,-4,PS2533L-1,-2,-4
Lead bending type
PS2533L-1
PS2533L-2
5.1 MAX. 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2
10.2 MAX. 8 7
TOP VIEW
6 5 1, 3. Anode 2, 4. Cathode 5, 7. Emitter 6, 8. Collector 1 2 3 4
6.5
0.05 to 0.2
3.8 MAX.
0.90.25 2.54 1.250.15 0.25 M 9.600.4
1.250.15 0.25 M 2.54
3.8 MAX.
0.90.25 9.600.4
PS2533L-1 (NEW PACKAGE)
PS2533L-4 TOP VIEW
16 15 14 13 12 11 10 9
4.60.35 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 20.3 MAX. 1 2 3 4 5 6 7 8
1, 3, 5, 7. 2, 4, 6, 8. 9, 11, 13, 15. 10, 12, 14, 16.
Anode Cathode Emitter Collector
6.5
0.05 to 0.2
3.8 MAX.
0.90.25 2.54 1.250.15 0.25 M 9.600.4
3.8 MAX.
1.250.15 0.25 M 2.54
0.90.25 9.600.4
0.05 to 0.2
7.62
6.5
7.62
0.05 to 0.2
7.62
6.5
7.62
3
PS2533-1,-2,-4,PS2533L-1,-2,-4
Lead bending type for long distance
PS2533L1-1
PS2533L2-1
5.1 MAX. 5.1 MAX. 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2
6.5
6.5
10.16 7.62
2.8 MIN. 4.25 MAX. 3.8 MAX. 3.8 MAX.
10.16 7.62
0.250.2
0.35
0 to 15 0.500.10 0.25 M
1.250.15 0.25 M
0.90.25 2.54 12.0 MAX.
1.250.15 2.54
PS2533L1
4.60.35 1.00.2 4.60.35 1.00.2
PS2533L2
TOP VIEW
4 3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 4
TOP VIEW
3 1. Anode 2. Cathode 3. Emitter 4. Collector 1 2 10.16 7.62
3.8 MAX. 0.250.2
6.5
10.16 7.62
3.2 MIN. 4.25 MAX. 3.8 MAX.
6.5
0 to 15 0.500.10 0.25 M 2.54
1.250.15 0.25 M
0.35
0.90.25 2.54 12.0 MAX.
1.250.15
4
PS2533-1,-2,-4,PS2533L-1,-2,-4
ORDERING INFORMATION
Part Number PS2533-1 PS2533L-1 PS2533L1-1 PS2533L2-1 PS2533-2 PS2533L-2 PS2533-4 PS2533L-4 PS2533-1-V PS2533L-1-V PS2533L1-1-V PS2533L2-1-V PS2533-2-V PS2533L-2-V PS2533-4-V PS2533L-4-V Package 4-pin DIP 4-pin DIP (lead bending surface mount) 4-pin DIP (for long distance) 4-pin DIP (for long distance surface mount) 8-pin DIP 8-pin DIP (lead bending surface mount) 16-pin DIP 16-pin DIP (lead bending surface mount) 4-pin DIP 4-pin DIP (lead bending surface mount) 4-pin DIP (for long distance) 4-pin DIP (for long distance surface mount) 8-pin DIP 8-pin DIP (lead bending surface mount) 16-pin DIP 16-pin DIP (lead bending surface mount) VDE0884 approved products (Option) Safety Standard Approval Standard products (UL, BSI, NEMKO, SEMKO, DEMKO, FIMKO approved) Application Part Number PS2533-1
*1
PS2533-2 PS2533-4 PS2533-1
PS2533-2 PS2533-4
*1 As applying to Safety Standard, following part number should be used.
5
PS2533-1,-2,-4,PS2533L-1,-2,-4
ABSOLUTE MAXIMUM RATINGS (TA = 25 C, unless otherwise specified)
Ratings Parameter Symbol PS2533-1, PS2533L-1 80 6 1.5 150 1 350 0.6 150 3.0 300 5 000 *3 3 750 -55 to +100 -55 to +150 2.4 240 1.2 120
PS2533-2, -4, PS2533L-2, -4
Unit
Diode
Forward Current (DC) Reverse Voltage Power Dissipation Derating Power Dissipation Peak Forward Current
*1
IF VR
mA V mWC mW/ch A V V mA/ch mW/C mW/ch Vr.m.s. C C
PD/C
PD IFP VCEO VECO IC
Transistor
Collector to Emitter Voltage Emitter to Collector Voltage Collector Current Power Dissipation Derating Power Dissipation
PC/C
PC BV TA Tstg
Isolation Voltage
*2
Operating Ambient Temperature Storage Temperature
*1 PW = 100 s, Duty Cycle = 1 % *2 AC voltage for 1 minute at TA = 25 C, RH = 60 % between input and output *3 VDE0884 approved products (Option)
6
PS2533-1,-2,-4,PS2533L-1,-2,-4
ELECTRICAL CHARACTERISTICS (TA = 25 C)
Parameter Diode Forward Voltage Reverse Current Terminal Capacitance Transistor Coupled Collector to Emitter Dark Current Current Transfer Ratio (IC/IF) Collector Saturation Voltage Isolation Resistance Isolation Capacitance Rise Time Fall Time
*1
Symbol VF IR Ct ICEO CTR VCE (sat) RI-O CI-O tr tf IF = 10 mA VR = 5 V
Conditions
MIN.
TYP. 1.15
MAX. 1.40 5
Unit V
A
pF
V = 0 V, f = 1.0 MHz VCE = 350 V, IF = 0 mA IF = 1 mA, VCE = 2 V IF = 1 mA, IC = 2 mA VI-O = 1.0 kVDC V = 0 V, f = 1.0 MHz VCC = 5 V, IC = 10 mA, RL = 100 10
11
30 400 1 500 4 000 6 500 1.0
nA % V
0.6 100 100
pF
s
*1
*1 Test circuit for switching time
Pulse input (PW = 1 ms, Duty cycle = 1/10) IF 50 VOUT RL = 100 VCC
7
PS2533-1,-2,-4,PS2533L-1,-2,-4
TYPICAL CHARACTERISTICS (TA = 25 C, unless otherwise specified)
DIODE POWER DISSIPATION vs. AMBIENT TEMPERATURE
Transistor Power Dissipation PC (mW)
TRANSISTOR POWER DISSIPATION vs. AMBIENT TEMPERATURE
400
150
Diode Power Dissipation PD (mW)
100 PS2533-2, -4 PS2533L-2, -4 50
PS2533-1 PS2533L-1 1.5 mW/C
300 PS2533-1 PS2533L-1 200 PS2533-2, -4 PS2533L-2, -4 100 2.4 mW/C 3.0 mW/C
1.2 mW/C
0
25
50
75
100
125
150
0
25
50
75
100
125
150
Ambient Temperature TA (C)
Ambient Temperature TA (C)
FORWARD CURRENT vs. FORWARD VOLTAGE
100 TA = +100 C +75 C +50 C +25 C 0 C -25 C -55 C
COLLECTOR CURRENT vs. COLLECTOR TO EMITTER VOLTAGE
160 140
Collector Current IC (mA)
5.0
Forward Current IF (mA)
10
120 100 80 60 40 20
4.5 mA mA mA 4.0 mA 3.5 mA 3.0
1
mA 2.5 A 2.0 m
1.5 mA
0.1
1.0 mA
IF = 0.5 mA 1 2 3 4 5 6 7 8
0.01 0.6
0.8
1.0
1.2
1.4
1.6
0
Forward Voltage VF (V)
Collector to Emitter Voltage VCE (V)
COLLECTOR TO EMITTER DARK CURRENT vs. AMBIENT TEMPERATURE
Collector to Emitter Dark Current ICEO (A)
COLLECTOR CURRENT vs. COLLECTOR SATURATION VOLTAGE
500
10 1 100 n 10 n 1n 100 p
VCE = 350 V
Collector Current IC (mA)
100 50 10 5 1 0.5 0.1 0.0
mA IF = 5.0 A 2.0 m 1.0 mA
0.5 mA
-50
-25
0
25
50
75
100
0.2
0.4
0.6
0.8
1.0
1.2
Ambient Temperature TA (C)
Collector Saturation Voltage VCE(sat) (V)
8
PS2533-1,-2,-4,PS2533L-1,-2,-4
NORMALIZED CURRENT TRANSFER RATIO vs. AMBIENT TEMPERATURE
Normalized Current Transfer Ratio CTR
CURRENT TRANSFER RATIO vs. FORWARD CURRENT
5 000
Current Transfer Ratio CTR (%)
1.2 1.0 0.8 0.6 0.4 0.2 0.0
,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,, ,,,,,,,,,,,,,,,,
Normalized to 1.0 at TA = 25 C, IF = 1 mA, VCE = 2 V 50 75 -50 -25 0 25 100 Ambient Temperature TA (C)
VCE = 2 V Sample A Sample B
4 000
3 000
2 000
1 000 0 0.1
0.5
1
5
10
15
Forward Current IF (mA)
SWITCHING TIME vs. LOAD RESISTANCE
500 VCC = 10 V, IC = 10 mA 5 tr 0
Normalized Gain Gv
FREQUENCY RESPONSE
Switching Time t (s)
100 50 td tf 10 5 ts 1 20
-5 -10
RL = 1 k
100
10
VCE = 4 V, Vin = 0.1 Vp-p -15 -20 -25 1 k 1 F Vin
47
RL
Vout 1 10 100
50
100
200
500
1k
2k
-30 0.01
0.1
Load Resistance RL ()
Frequency f (kHz)
LONG TERM CTR DEGRADATION
1.2 1.0
CTR (Relative Value)
0.8 0.6 0.4 0.2 0.0 10
IF = 1 mA, TA = 25 C IF = 1 mA, TA = 60 C
102
103
104
105
106
Time (Hr)
Remark The graphs indicate nominal characteristics.
9
PS2533-1,-2,-4,PS2533L-1,-2,-4
TAPING SPECIFICATIONS (in millimeters)
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
4.30.2
7.50.1
16.00.3
1.550.1 8.00.1
0.3
5.60.1
Tape Direction
PS2533L-1-E3, F3 PS2533L-1-E4, F4
Outline and Dimensions (Reel)
2.00.5 13.00.5
PS2533L-1-E3, E4: 250 PS2533L-1-F3, F4: 330
R 1.0
21.00.8
80.05.0
10.30.1
16.4+2.0 -0.0
Packing: PS2533L-1-E3, E4 1 000 pcs/reel PS2533L-1-F3, F4 2 000 pcs/reel
10
PS2533-1,-2,-4,PS2533L-1,-2,-4
Outline and Dimensions (Tape)
2.00.1 4.00.1
1.750.1
1.550.1
4.30.2
16.00.3 10.30.1
7.50.1
1.550.1 12.00.1
10.40.1
0.3
Tape Direction
PS2533L-2-E3
PS2533L-2-E4
Outline and Dimensions (Reel)
2.00.5 13.00.5
R 1.0
21.00.8
80.05.0
330
16.4+2.0 -0.0
Packing: 1 000 pcs/reel
11
PS2533-1,-2,-4,PS2533L-1,-2,-4
RECOMMENDED SOLDERING CONDITIONS
(1) Infrared reflow soldering * Peak reflow temperature * Time of temperature higher than 210 C * Number of reflows * Flux 235 C (package surface temperature) 30 seconds or less Three Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.)
Recommended Temperature Profile of Infrared Reflow
Package Surface Temperature T (C)
(heating) to 10 s 235 C (peak temperature) 210 C to 30 s 120 to 160 C 60 to 90 s (preheating)
Time (s)
Peak temperature 235 C or below
(2) Dip soldering * Temperature * Time * Number of times * Flux 260 C or below (molten solder temperature) 10 seconds or less One Rosin flux containing small amount of chlorine (The flux with a maximum chlorine content of 0.2 Wt % is recommended.) (3) Cautions * Fluxes Avoid removing the residual flux with freon-based and chlorine-based cleaning solvent.
12
PS2533-1,-2,-4,PS2533L-1,-2,-4
SPECIFICATION OF VDE MARKS LICENSE DOCUMENT (VDE0884)
Parameter Application classification (DIN VDE 0109) for rated line voltages 300 Vr.m.s. for rated line voltages 600 Vr.m.s. Climatic test class (DIN IEC 68 Teil 1/09.80) Dielectric strength maximum operating isolation voltage Test voltage (partial discharge test, procedure a for type test and random test) Upr = 1.2 x UIORM, Pd < 5 pC Test voltage (partial discharge test, procedure b for random test) Upr = 1.6 x UIORM, Pd < 5 pC Highest permissible overvoltage Degree of pollution (DIN VDE 0109) Clearance distance Creepage distance Comparative tracking index (DIN IEC 112/VDE 0303 part 1) Material group (DIN VDE 0109) Storage temperature range Operating temperature range Isolation resistance, minimum value VIO = 500 V dc at TA = 25 C VIO = 500 V dc at TA MAX. at least 100 C Safety maximum ratings (maximum permissible in case of fault, see thermal derating curve) Package temperature Current (input current IF, Psi = 0) Power (output or total power dissipation) Isolation resistance VIO = 500 V dc at TA = 175 C (Tsi) Tstg TA CTI Symbol Speck Unit
IV III 55/100/21
UIORM Upr
890 1 068
Vpeak Vpeak
Upr
1 424
Vpeak
UTR
6 000 2 > 7.0 > 7.0 175 III a -55 to +150 -55 to +100
Vpeak
mm mm
C C
Ris MIN. Ris MIN.
10 11 10
12
Tsi Isi Psi Ris MIN.
175 400 700 10
9
C mA mW
13
PS2533-1,-2,-4,PS2533L-1,-2,-4
APPLICATION FOR TELEPHONE (EXAMPLE)
LINE Bell Ringing Signal (75 Vr.m.s., 16 Hz) PS2505-1, PS2506-1 PS2605, PS2606 PS2607, PS2608 etc.
VCC Bell Ringing Detect
PS2521 PS2525
Line Observe VCC
Dial Pulse PS2532 Generator PS2533
Dialer Circuit
CPU
Photo MOS FET
Speech Circuit
IN OUT
14
PS2533-1,-2,-4,PS2533L-1,-2,-4
[MEMO]
15
PS2533-1,-2,-4,PS2533L-1,-2,-4
CAUTION
Within this device there exists GaAs (Gallium Arsenide) material which is a harmful substance if ingested. Please do not under any circumstances break the hermetic seal.
NEPOC is a trademark of NEC Corporation.
No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance. Anti-radioactive design is not implemented in this product.
M4 96. 5

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